The SIM8200G is Multi‐Band 5G NR/LTE‐FDD/LTE‐TDD/HSPA+ module solution in a LGA type which supports R15 5g NSA/SA up to 4.0 Gbps data transfer.
It has strong extension capability with rich interfaces including UART,PCIe,USB3.1, GPIO etc. The module provides much flexibility and ease of integration for customer’s application.
The package of SIM8200G is LGA form factor. This also minimize the investments of customers, and enables a short time‐to‐market.
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General Features
• Supply voltage range: 3.3V ~ 4.3V
• Control Via AT Commands • Operation temperature: ‐40℃ ~ +85℃ • Dimensions: 41.0*43.6*2.8mm • Weight: TBD • Sub‐6G/LTE‐FDD/LTE‐TDD/WCDMA • Support UL 2XCA • GNSS:GPS/GLONASS/BeiDou/Galileo/QZSS |
Data
• Sub‐6G
‐ Uplink up to 450Mbps ‐ Downlink up to 4 Gbps • LTE CAT22 ‐ Uplink up to 200Mbps ‐ Downlink up to 2.4Gbps • HSPA+ ‐ Uplink up to 5.76Mbps ‐ Downlink up to 42.0Mbps |
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Other Features
• USB Driver for Microsoft Windows Win7/Win8/Win10
• USB Driver for Linux /Android • RIL supporting for Android 5.0/6.0/7.0/8.0 • RNDIS /NDIS/PPP/MBIM to Win8 • Firmware update via USB • TCP/IP/IPV4/IPV6/Multi‐PDP/FTPS /HTTPS/MQTTS/DNS • SSL3.0/TLS1.0/TLS1.2 • DTMF (Sending and Receiving) • VoNR/VoLTE/CSFB • FOTA/OTA • AGPS/SUPL2.0 Approvals
• RoHS Compliant
• CCC* • CTA* • SRRC* • REACH* • CE* • FCC* • GCF • RCM |
Interfaces
• USB2.0 with High speed up to 480Mbps
• USB3.1 with SS Gen2 • UART • USIM and E‐SIM interface(1.8V /2.85V) • Digital Audio through PCM • I2C • I2S for Audio • SPI • ADC • GPIOs • RGMII • PCIe Gen3 • SDIO3.0 • WIFI • PMI • Antenna x 8 |
Frequency
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5G NR |
n1,n2,n3,n5,n7,n8,n12,n20,n25,n28,n40,n41,n66,n71,n77,n78,n79 |
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LTE-TDD |
B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B32/B66/B71 |
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LTE‐TDD |
B34/B38/B39/B40/B41/B42/B43/B48 |
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WCDMA |
B1/B2/B3/B4/B5/B8 |
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